Heat-dissipation base structure

ABSTRACT

A heat-dissipation base structure includes a main board and at least one mounting member. The main board has four chamfered corners to form four pressing ends and is provided on an upper face with at least one retaining section. The mounting member is provided with at least one locating section for engaging with the at least one retaining section, and includes at least one outward extended arm portion. The arm portion is formed along a bottom with a downward protruded portion, so an opening is formed on the arm portion at a proximal end of the downward protruded portion for engaging with one pressing end of the main board when the mounting member and the arm portion are mounted to the upper face of the main board. Therefore, the heat-dissipation base structure has increased structural strength and the arm portion is less possibly deformed due to bending stress therein.

FIELD OF THE INVENTION

The present invention relates to a heat-dissipation base structure, andmore particularly to a heat-dissipation base structure that hasincreased structural strength and ensures tight contact with a heatsource to reduce the thermal resistance thereof.

BACKGROUND OF THE INVENTION

The currently available electronic apparatuses or electronic devices allinclude a computing electronic element, which would produce heat duringoperation thereof but could not dissipate heat by itself. Therefore, theelectronic apparatuses or devices require a heat dissipation unit toassist in the dissipation of heat produced by the computing electronicelement thereof. Some common heat dissipation units include heat sinks,radiating fin assemblies, heat pipes, heat dissipating plates, vaporchambers and so on. Since the heat-producing electronic elements forvarious electronic devices are different in size and specification, notall the above-mentioned heat dissipation units can be directly connectedto a heat source. Usually, a heat dissipation unit is first assembled toa heat-dissipation base, and the heat-dissipation base is then broughtto contact with a heat-producing electronic element to assist in thedissipation of heat produced by the electronic element. Theheat-dissipation base in contact with the heat-producing electronicelement must be retained to a desired position. To do so, theheat-dissipation base usually includes arm portions extended from fourcorners thereof, and the arm portions are provided at their respectivedistal end with a mounting hole. Via the mounting holes, fasteningelements can be extended into a circuit board, on which the electronicelement is mounted, so that the heat-dissipation base is locked to thecircuit board and in tight contact with the heat-producing electronicelement.

Conventionally, the heat-dissipation base is manufactured by stamping orpunching a sheet material. The extended arm portions of theheat-dissipation base are thin and long and therefore have relativelyweak structural strength. In the process of extending fastening elementsthrough the mounting holes on the distal ends of the arm portions, thearm portions are subject to deformation due to the fastening forceapplied thereto, making the heat-dissipation base a defective product,which causes inconvenience in mounting and increased production cost.

SUMMARY OF THE INVENTION

A primary object of the present invention is to provide aheat-dissipation base structure having increased structural strength andensuring tight contact with a heat source to reduce the thermalresistance thereof.

To achieve the above and other objects, the heat-dissipation basestructure according to the present invention includes a main board andat least one mounting member. The main board has four chamfered cornersto form four pressing ends and is provided on an upper face with atleast one retaining section. The mounting member is provided with atleast one locating section for engaging with the at least one retainingsection, and includes at least one outward extended arm portion. The armportion is formed along a bottom with a downward protruded portion, suchthat an opening is formed on the arm portion at a proximal end of thedownward protruded portion for engaging with one pressing end of themain board when the mounting member and the arm portion are mounted tothe upper face of the main board. With the above arrangements, theheat-dissipation base structure has increased structural strength andthe arm portion is less possibly deformed due to a bending stressthereof.

BRIEF DESCRIPTION OF THE DRAWINGS

The structure and the technical means adopted by the present inventionto achieve the above and other objects can be best understood byreferring to the following detailed description of the preferredembodiments and the accompanying drawings, wherein

FIG. 1 is an exploded perspective view of a heat-dissipation basestructure according to a first embodiment of the present invention;

FIG. 2 is an assembled view of FIG. 1;

FIG. 3 is a sectional side view of FIG. 2; and

FIG. 4 is an assembled perspective view of a heat-dissipation basestructure according to a second embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

The present invention will now be described with some preferredembodiments thereof and with reference to the accompanying drawings. Forthe purpose of easy to understand, elements that are the same in thepreferred embodiments are denoted by the same reference numerals.

Please refer to FIGS. 1 and 2 that are exploded and assembledperspective views, respectively, of a heat-dissipation base structureaccording to a first embodiment of the present invention, and to FIG. 3that is a sectional side view of FIG. 2. As shown, the heat-dissipationbase structure in the first embodiment includes a main board 1 and atleast one mounting member 2.

The main board 1 has four chamfered corners to form four pressing ends11, and is provided on an upper face thereof with at least one retainingsection 12. The mounting member 2 is provided with at least one locatingsection 21 corresponding to the at least one retaining section 12.

The mounting member 2 is connected to the main board 1 via engagement ofthe at least one locating section 21 with the at least one retainingsection 12. In the illustrated first embodiment, the retaining section12 is in the form of a stub and the locating section 21 is in the formof a through hole. However, it is understood the retaining section 12and the locating section 21 are not necessarily limited to the form ofstub and through hole, and the mounting member 2 can be connected to themain board 1 by scarf joint, snap-on joint, or welding.

The mounting member 2 includes at least one arm portion 22 horizontallyoutward extended from an end thereof. The arm portion 22 is soconfigured that it has at least one downward protruded portion 221formed along a bottom thereof, and an opening 222 is formed on the armportion 22 at a proximal end of the downward protruded portion 221. Thearm portion 22 is provided at a distal end thereof with at least onemounting hole 223.

The mounting member 2 is mounted to the upper face of the main board 1with the arm portion 22 angularly projected beyond one corner of themain board 1, such that the downward protruded portion 221 of the armportion 22 is located below a plane defined by a lower face of the mainboard 1 and the pressing end 11 at each corner of the main board 1 isaligned and engaged with the opening 222 on the corresponding armportion 22.

To assemble the main board 1 and the mounting member 2 to each other,simply align and engage the locating sections 21 on the mounting member2 with the retaining sections 12 on the main board 1, and the pressingends 11 of the main board 1 will respectively engage with the opening222 on the corresponding arm portion 22 of the mounting member 2. Withthese arrangements, the mounting member 2 can have effectively increasedstructural strength to bear the force externally applied to the armportion 22. The downward protruded portion 221 of the arm portion 22located lower than the main board 1 also functions to prevent the armportion 22 from deformation due to the bending moment stress in the armportion 22 under the force externally applied thereto. With the armportion 22 having increased structural strength, it is also possible forthe main board 1 to more tightly contact with the heat source to reducethe thermal resistance of the heat-dissipation base structure of thepresent invention.

FIG. 4 is an assembled perspective view of a heat-dissipation basestructure according to a second embodiment of the present invention. Asshown, the second embodiment is generally structurally similar to thefirst embodiment, except that, in the second embodiment, the arm portion22 further includes a bent section 224. The downward protruded portion221 is also formed on one side surface of the bent section 224 facingtoward the main board 1. In the present invention, the downwardprotruded portion 221 may be a continuously extended single portion orinclude several serially spaced portions. In the illustratedembodiments, the downward protruded portion 221 is shown as acontinuously extended single portion. With the bent section 224 and thedownward protruded portion 221, the arm portion 22 may have furtherincreased structural strength to resist any deformation thereof when themounting member 2 is fastened to a circuit board via the mounting hole223. Again, the arm portion 22 with further increased structuralstrength also enables the main board 1 to more tightly contact with theheat source to reduce the thermal resistance of the heat-dissipationbase structure of the present invention.

The present invention has been described with some preferred embodimentsthereof and it is understood that many changes and modifications in thedescribed embodiments can be carried out without departing from thescope and the spirit of the invention that is intended to be limitedonly by the appended claims.

What is claimed is:
 1. A heat-dissipation base structure, comprising: amain board having four chamfered corners to form a pressing end each,and being provided on an upper face with at least one retaining section;and at least one mounting member being provided with at least onelocating section for correspondingly engaging with the at least oneretaining section on the main board, and including at least onehorizontally outward extended arm portion; the arm portion being soconfigured that a downward protruded portion is formed along a bottomthereof and an opening is formed on the arm portion at a proximal end ofthe downward protruded portion to correspond to one pressing end of themain board.
 2. The heat-dissipation base structure as claimed in claim1, wherein the arm portion is provided on a distal end thereof with atleast one mounting hole.
 3. The heat-dissipation base structure asclaimed in claim 1, wherein the mounting member and the arm portion areconnected to the upper face of the main board.
 4. The heat-dissipationbase structure as claimed in claim 3, wherein the downward protrudedportion of the arm portion is located below a plane defined by a lowerface of the main board.
 5. The heat-dissipation base structure asclaimed in claim 1, wherein the pressing end at each corner of the mainboard is aligned and engaged with the opening at the proximal end of thedownward protruded portion of the arm portion.
 6. The heat-dissipationbase structure as claimed in claim 1, wherein the arm portion furtherincludes a bent section.
 7. The heat-dissipation base structure asclaimed in claim 6, wherein the downward protruded portion is alsoformed on one side surface of the bent section facing toward the mainboard.